Semiconductor device having dual stacked MIM capacitor and method of fabricating the same

ABSTRACT

Semiconductor devices having a dual stacked MIM capacitor and methods of fabricating the same are disclosed. The semiconductor device includes a dual stacked MIM capacitor formed on the semiconductor substrate. The dual stacked MIM capacitor includes a lower plate positioned, an upper plate electrically connected to the lower plate and positioned above the lower plate, and an intermediate plate interposed between the lower plate and the upper plate. An upper interconnection line is positioned at the same level as the upper plate. The upper interconnection line is electrically connected to the intermediate plate. As a result, the upper plate may be formed by a damascene process.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to semiconductor devices and methods of fabricating the same. More particularly, the present invention generally relates to semiconductor devices having a dual stacked MIM capacitor and methods of fabricating the same.

A claim of priority is made to Korean Patent Application No. 2004-7362, filed Feb. 4, 2004, the contents of which are incorporated by reference in their entirety.

2. Description of the Related Art

In general, it is easy to control the capacitance for a Metal-Insulator-Metal (MIM) capacitor, because changes in its capacitance change due to voltage and frequency fluctuations are small as compared to a poly-insulator-poly (PIP) capacitor. Therefore, the MIM capacitor is widely used for Applications, such as an analog to digital (AD) converter, an RF device, a switching capacitor filter, and a CMOS image sensor (CIS).

As semiconductor devices have become highly integrated, a MIM capacitor having a higher capacitance per unit of chip area is required. A semiconductor device having a dual stacked MIM capacitor, wherein the capacitor has a high capacitance per unit of chip area has been proposed.

.U.S Patent Publication No. 2003/0197215 (A1) discloses one method of fabricating a semiconductor device having the dual stacked MIM capacitor.

This method discloses forming a stacked layer having a top metal layer, an intermediate metal layer, and a bottom metal layer. The top metal layer is patterned to form a metal plate associated with a first MIM capacitor, the intermediate metal layer is patterned to form metal plates associated with the first and a second MIM capacitors, and the bottom metal layer is patterned to form a metal plate associated with the second MIM capacitor. A via formed in contact with the patterned intermediate metal layer and at least two vias formed in contact with the patterned top metal layer and the patterned bottom metal layer are formed, wherein the at least two vias are electrically connected to each other.

According to this method, a dual stacked MIM capacitor may be fabricated to ensure a high capacitance per unit of chip area. However, each of the top metal layer, the intermediate metal layer, and the bottom metal layer is patterned using separate photolithography and etching processes. As a result, at least three photomasks are required to pattern these metal layers.

SUMMARY OF THE INVENTION

The present invention provides a semiconductor device including a semiconductor substrate, a dual stacked MIM capacitor having a lower plate disposed above the semiconductor substrate, an upper plate electrically connected to the lower plate and disposed above the lower plate, and an intermediate plate interposed between the lower plate and the upper plate, and a first upper interconnection line positioned at the same level as the upper plate and electrically connected to the intermediate plate.

The present invention also discloses a method of manufacturing a semiconductor device having a dual stacked MIM capacitor by forming a lower insulating layer a semiconductor substrate, forming a patterned lower plate and a lower interconnection line on the lower insulating layer, forming an patterned intermediate plate comprising a first intermediate plate conductive layer, a second intermediate plate conductive layer, and a third intermediate plate conductive layer, sequentially forming an etch stop layer and an upper insulating layer on the patterned intermediate plate, patterning the upper insulating layer to form a plurality of trenches, forming a first via hole to expose the patterned lower plate, a second via hole to expose the patterned intermediate plate, and a third via hole to expose the lower interconnection line, and filling the plurality of trenches and via holes with a conductive material, thereby forming a patterned upper plate electrically connected to the patterned lower plate, a patterned first upper interconnection line electrically connected to the patterned intermediate plate, and a patterned second interconnection line electrically connected to the lower connection line.

Also disclosed is a method of forming a lower insulating layer on a semiconductor substrate, forming a patterned lower plate and a lower interconnection line on the lower insulating layer, forming a patterned intermediate plate comprising a first intermediate plate conductive layer, a second intermediate plate conductive layer, and a third intermediate plate conductive layer, forming a spacer on sidewalls of the patterned intermediate plate, sequentially forming an etch stop layer and an upper insulating layer on the patterned intermediate plate, patterning the upper insulating layer to form a plurality of trenches, forming a first via hole to expose the patterned lower plate, a second via hole to expose the patterned intermediate plate, and a third via hole to expose the lower interconnection line, and filling the plurality of trenches and via holes with a conductive material, thereby forming a patterned upper plate electrically connected to the patterned lower plate, a patterned first upper interconnection line electrically connected to the patterned intermediate plate, and a patterned second interconnection line electrically connected to the lower connection line.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present invention will be apparent from the detailed description of the present invention in view of the accompanying drawings. The drawing is not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.

FIG. 1 is a layout of a semiconductor device having a dual stacked MIM capacitor in accordance with an exemplary embodiment of the present invention.

FIGS. 2 to 8 are cross-sectional views taken along line I-I of FIG. 1 to illustrate a method of fabricating a dual stacked MIM capacitor in accordance with exemplary embodiments of the present invention.

FIGS. 9 to 15 are cross-sectional views to illustrate another method of fabricating a dual stacked MIM capacitor.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. It will be understood that when an element such as a layer, a region or a substrate is referred to as being “on” or “onto” another element, it can be directly on the other element or intervening elements may also be present.

Reference “A” in FIG. 1 indicates a predetermined region of an upper portion of a semiconductor substrate having a dual stacked MIM capacitor region.

Referring to FIG. 1 and FIG. 8, a patterned lower plate 26 a is disposed on a semiconductor substrate 21. The patterned lower plate 26 a includes a lower plate 26 a″. In addition, patterned lower plate 26 a may include a first connecting portion 26 a′ electrically connected to the lower plate 26 a″. A lower interconnection line 26 b is disposed at the same level as patterned lower plate 26 a on semiconductor substrate 21. A lower insulating layer 23 insulates patterned lower plate 26 a and lower interconnection line 26 b. In addition, insulating layer 23 is interposed between semiconductor substrate 21, and patterned lower plate 26 a and lower interconnection line 26 b.

Patterned lower plate 26 a and lower interconnection line 26 b are formed of the same material such as W, Al, or Cu. In addition, barrier metal layers 27 a and 27 b are disposed at an upper portion of patterned lower plate 26 a and lower interconnection line 26 b, respectively. Barrier metal layers 27 a and 27 b prevent metal atoms from metal layers 25 a and 25 b from diffusing into layers subsequently formed on patterned lower plate 26 a and lower interconnection line 26 b. For example, if metal layers 25 a and 25 b are Cu, barrier metal layers 27 a and 27 b may be formed from a metal nitride layer such as TiN, TaN or WN, a ternary compound layer containing Si or Al such as TaSiN or TaAlN, a noble metal layer such as Ir, Pt or Ru, or similar layer such as Ti or Ta.

A patterned upper plate 51 a is positioned above patterned lower plate 26 a patterned upper plate 51 a includes an upper plate 51 a″. In addition, a first upper interconnection line 51 b is positioned at the same level as patterned upper plate 51 a. Furthermore, a second upper interconnection line 51 c is formed apart from first upper interconnection line 51 b, but formed at the same level as first upper interconnection line 51 b. Second upper interconnection line 51 c is positioned above lower interconnection line 26 b. First patterned upper plate 51 a, first upper interconnection line 51 b, and second upper interconnection line 51 c are preferably insulated from one another by an upper insulating layer 47 and an etch-stop layer 45.

A patterned intermediate plate 32 a is disposed between patterned lower plate 26 a and patterned upper plate 51 a. Patterned intermediate plate 32 a includes an intermediate plate 32 a″ interposed between lower plate 26 a″ and upper plate 51 a″. Patterned intermediate plate 32 a is a stacked layer of a patterned first intermediate plate 31 a, a patterned second intermediate plate 33 a, and a patterned third intermediate plate 35 a. In addition, patterned intermediate plate 32 a may further include a second connecting portion 32 a′ electrically connected to the intermediate plate 32 a″. Patterned upper plate 51 a may further include a third connecting portion 51 a′ electrically connected to the upper plate 51 a″.

Preferably, patterned upper plate 51 a, first upper interconnection line 51 b, and second upper interconnection line 51 c are preferably formed of the same material such as W, Al, or Cu. Patterned second intermediate plate 33 a is interposed between patterned first intermediate plate 31 a and patterned third intermediate plate 35 a. Preferably, each of patterned first and third intermediate plates 31 a and 35 a is Ta, Ti, TaN, TiN, WN, or Ru layer. In addition, patterned second intermediate plate 33 a is an Al or W layer. As a result, the resistance of the intermediate plate is reduced, which provides a capacitor having excellent operating properties at a high frequency.

A lower dielectric layer 29 is interposed between patterned lower plate 26 a and patterned intermediate plate 32 a. In addition, first upper dielectric layer 37 and second upper dielectric layer 43 are interposed between patterned intermediate plate 32 a and patterned upper plate 51 a. Preferably, each of lower dielectric layer 29 and first and second upper dielectric layers 37 and 43 is formed from an oxidation material such as Al₂O₃, HfO₂, Ta₂O₅, La₂O₃, SrTiO₃ (ST), Ba_(x)Sr_(1-x)TiO₃, PbZr_(x)Ti_(1-x)O₃ (PZT), SrBi₂Ta₂O₅ or Zr₂O₃, silicon nitride (SiN), or an oxynitride.

Lower dielectric layer 29 preferably extends across patterned lower plate 26 a and lower interconnection line 26 b. First upper dielectric layer 37 preferably extends to cover sidewalls of patterned intermediate plate 32 a and lower dielectric layer 29. In addition, second dielectric layer 43 preferably extends to cover the lower portions of patterned upper plate 51 a, first upper interconnection line 51 b, and second upper interconnection line 51 c. First upper dielectric layer 37 also prevents metal atoms from diffusing from metal layers 25 a and 25 b. Therefore, if barrier metal layers 27 a and 27 b and/or lower dielectric layer 29 sufficiently prevent metal atoms from diffusing, first upper dielectric layer 37 may be omitted.

Patterned upper plate 51 a and patterned lower plate 26 a are electrically connected to each other. Preferably, patterned upper plate 51 a and patterned lower plate 26 a are electrically connected to each other by a first via 53 a, and which is formed through first and second upper dielectric layers 37 and 43 and lower dielectric layer 29. A third upper interconnection line 51 d may be disposed to cross over the first via 53 a. (FIG. 1) Third upper interconnection line 51 d may be a power line to apply a voltage to patterned lower and upper plates 26 a and 51 a. Patterned intermediate plate 32 a and first upper interconnection line 51 b are electrically connected to each other. Here, first upper interconnection line 51 b is a power line to apply voltage to patterned intermediate plate 32 a. Preferably, patterned intermediate plate 32 a and first upper interconnection line 51 b are electrically connected to each other by a second via 53 b, which is formed through first and second upper dielectric layers 37 and 43. In addition, lower interconnection line 26 b and second upper interconnection line 51 c are electrically connected to each other. Here, lower interconnection line 26 b and second upper interconnection line 51 c are directly and electrically connected to each other by a third via 53 c, which is formed through lower dielectric layer 29 and first and second upper dielectric layers 37 and 43. Accordingly, first via 53 a is positioned at the same level as third via 53 c.

An inter-insulating layer 41 fills empty spaces between patterned upper plate 51 a, first upper interconnection line 51 b, and second upper interconnection line 51 c, and patterned lower plate 26 a and lower interconnection line 26 b. In addition, a polish stopping layer 39 may be interposed between inter-insulating layer 41 and first upper dielectric layer 37.

Hereinafter, a semiconductor device having a dual stacked MIM capacitor in accordance with another embodiment of the present invention will be described in some additional detail.

FIG. 15 is a cross-sectional view to illustrate a semiconductor device having a dual stacked MIM capacitor in accordance with another embodiment of the present invention.

Referring to FIG. 15, a patterned lower plate 65 a is positioned on a semiconductor substrate 61. Patterned lower plate 65 a includes a lower plate 65 a″. In addition, patterned lower plate 65 a may include a first connecting portion 65 a′ electrically connected to the lower plate 65 a″. A lower interconnection line 65 b is positioned at the same level as patterned lower plate 65 a. A lower insulating layer 63 insulates lower interconnection line 65 b and lower connection line 65 a. Furthermore, lower insulating layer 63 is disposed on semiconductor substrate 61. Patterned lower plate 65 a and lower interconnection line 65 b are formed of the same material, for example, W, Al, or Cu.

A patterned upper plate 93 a is positioned above patterned lower plate 65 a. Patterned upper plate 93 a includes an upper plate 93 a″. In addition, a first upper interconnection line 93 b is positioned at the same level as patterned upper plate 93 a. In addition, second upper interconnection line 93 c is spaced apart from upper interconnection line 93 b and formed to be at the same level as first upper interconnection line 93 b. At least some portion of second upper interconnection line 93 c is positioned above lower interconnection line 65 b. Patterned upper plate 93 a, first upper interconnection line 93 b, and second upper interconnection line 93 c are insulated from one another by an upper insulating layer 91 and an etch-stop layer 89.

A patterned intermediate plate 72 a is positioned between patterned lower plate 65 a and patterned upper plate 93 a. Patterned intermediate plate 72 a includes an intermediate plate 72 a″ interposed between lower plate 65 a″ and upper plate 93 a″. Patterned intermediate plate 72 a may include a second connecting portion 72 a′ electrically connected to the intermediate plate 72 a″. Patterned upper plate 93 a may include a third connecting portion 93 a′ electrically connected to upper plate 93 a″. Patterned intermediate plate 72 a includes patterned first intermediate plate 71 a, a patterned second intermediate plate 73 a, and a patterned third intermediate plate.

Patterned upper plate 93 a, first upper interconnection line 93 b, and second upper interconnection line 93 c are formed of the same material as described for the first embodiment, i.e., FIG. 8.

A spacer 79 a covers sidewalls of patterned intermediate plate 72 a. In addition, a patterned lower dielectric layer 69 a is interposed between patterned lower plate 65 a and patterned intermediate plate 72 a. In addition, a patterned barrier metal layer 67 a is interposed between patterned lower dielectric layer 69 a and patterned lower plate 65 a. Patterned lower dielectric layer 69 a and patterned barrier metal layer 67 a have an extended portion interposed between spacer 79 a and semiconductor substrate 61. As a result, when patterned lower dielectric layer 69 a is formed using an etching process, properties of a capacitor do not deteriorate due to etch damage caused by patterning patterned lower dielectric layer 69 a.

A first upper dielectric layer 81 and a second upper dielectric layer 87 are interposed between patterned intermediate plate 72 a and patterned upper plate 93 a. As described with reference to FIG. 8, each of patterned lower dielectric layer 69 a and first and second upper dielectric layers 81 and 87 are formed from an oxidation material such as Al₂O₃, HfO₂, Ta₂O₅, La₂O₃, SrTiO₃ (ST), Ba_(x)Sr_(1-x)TiO₃, PbZr_(x)Ti_(1-x)O₃ (PZT), SrBi₂Ta₂O₅ or Zr₂O₃, a silicon nitride (SiN), or an oxynitride.

First upper dielectric layer 81 extends to cover sidewalls of the extended portion of spacer 79 a, patterned lower dielectric layer 69 a, patterned barrier metal layer 67 a, patterned lower plate 65 a, and lower interconnection line 65 b. In addition, second upper dielectric layer 87 extends to cover a lower portion of patterned upper plate 93 a, lower portions of first upper interconnection line 93 b and, second upper interconnection line 93 c. First upper dielectric layer 81 may be omitted.

Patterned upper plate 93 a and patterned lower plate 65 a are electrically connected to each other. Preferably, patterned upper plate 93 a and patterned lower plate 65 a are electrically connected to each other by a first via 95 a, which is formed through first and second upper dielectric layers 81 and 87. In addition, patterned intermediate plate 72 a and first upper interconnection line 93 b are electrically connected to each other. Preferably, patterned intermediate plate 72 a and upper interconnection line 93 b are electrically connected to each other by a second via 95 b, which is formed through first and second upper dielectric layers 81 and 87. In addition, lower interconnection line 65 b and second upper interconnection line 93 c are electrically connected to each other. Here, lower interconnection line 65 b and second upper interconnection line 93 c are directly and electrically connected to each other by a third via 95 c, which is formed through first and second upper dielectric layers 81 and 87. First via 95 a is positioned at the same level as the third via 95 c.

An inter-insulating layer 85 fills empty spaces between patterned upper plate 93 a, first upper interconnection line 93 b and second upper interconnection line 93 c, and patterned lower plate 65 a and lower interconnection line 65 b. In addition, a polish stopping layer 83 is interposed between inter-insulating layer 85 and first upper dielectric layer 81.

In the second embodiment, pacer 79 a is employed to prevent properties of the capacitor from deteriorating due to the etching damage caused by patterned lower dielectric layer 69 a.

Hereinafter, a method of fabricating a dual stacked MIM capacitor in accordance with an exemplary embodiment of the present invention will be described with reference to FIGS. 1-8.

Referring to FIG. 1 and FIG. 2, a lower insulating layer 23 is formed on a semiconductor substrate 21. Various elements such as transistors (not shown) or interconnection lines (not shown) may be formed within or on semiconductor substrate 21.

A patterned lower plate 26 a and a lower interconnection line 26 b are formed within lower insulating layer 23. Patterned lower plate 26 a includes a lower plate 26 a″. In addition, patterned lower plate 26 a may include a first connecting portion 26 a′ electrically connected to the lower plate 26 a″. Lower interconnection line 26 b is spaced apart from patterned lower plate 26 a.

Patterned lower plate 26 a and lower interconnection line 26 b may be formed using a damascene process. Specifically, lower insulating layer 23 is patterned to form trenches, which define patterned lower plate 26 a and lower interconnection line 26 b. A metal layer is formed to fill the trenches, and then the metal layer is planarized until lower insulating layer 23 is exposed to form metal layers 25 a and 25 b within the trenches. Barrier metal layer 27 a is formed above metal layer 25 a to define patterned lower plate 26 a, and barrier metal layer 27 b is formed above metal layer 25 b to define lower interconnection line 26 b. Barrier metal layers 27 a and 27 b may be formed by a selective deposition process. In addition, barrier metal layers 27 a and 27 b are formed by recessing metal layers 25 a and 25 b, depositing barrier metal material thereon, and planarizing the barrier metal material. Metal layers 25 a and 25 b are formed form a metal, such as W, Al, or Cu. Barrier metal layers 27 a and 27 b may be formed from a metal nitride layer such as TiN, TaN or WN, a ternary compound layer containing Si or Al such as TaSiN or TaAlN, a noble metal layer such as Ir, Pt or Ru, or similar layer such as Ti or Ta.

Alternatively, patterned lower plate 26 a and lower interconnection line 26 b may be formed using a photolithography process and an etching process. Specifically, after a metal layer is formed on lower insulating layer 23, the metal layer is patterned to form patterned lower plate 26 a and lower interconnection line 26 b. An insulating layer is then formed on semiconductor substrate 21 having patterned lower plate 26 a and lower interconnection line 26 b, and planarized to form an insulating layer to insulate patterned lower plate 26 a and lower interconnection line 26 b.

Referring to FIG. 1 and FIG. 3, a lower dielectric layer 29 and an intermediate plate conductive layer 32 are sequentially formed on semiconductor substrate 21 having patterned lower plate 26 a and the lower interconnection line 26 b. Lower dielectric layer 29 is formed of an oxidation material such as Al₂O₃, HfO₂, Ta₂O₅, La₂O₃, SrTiO₃ (ST), Ba_(x)Sr_(1-x)TiO₃, PbZr_(x)Ti_(1-x)O₃ (PZT), SrBi₂Ta₂O₅ or Zr₂O₃, silicon nitride (SiN), or oxynitride, and in addition, may be formed of at least two stacked layers. Intermediate plate conductive layer 32 includes a first intermediate plate conductive layer 31, a second intermediate plate conductive layer 33, and a third intermediate plate conductive layer 35, sequentially stacked. Each of first and third intermediate plate conductive layers 31 and 35 is formed from a material such as Ta, Ti, TaN, TiN, WN, or Ru. Second intermediate plate conductive layer 33 is formed from Al or W.

Referring to FIG. 1 and FIG. 4, intermediate plate conductive layer 32 is patterned to form a patterned intermediate plate 32 a. Patterned intermediate plate 32 a is a stacked structure comprising patterned first through third intermediate plates 31 a, 33 a, and 35 a. Patterned intermediate plate 32 a includes an intermediate plate 32 a″ disposed on lower plate 26 a″. In addition, patterned intermediate plate 32 a may include a second connecting portion 32 a′ electrically connected to the intermediate plate 32 a″.

Alternatively, patterned intermediate plate 32 a is formed by patterning intermediate plate conductive layer 32 using a photolithography process and an etching process.

After patterned intermediate plate 32 a is formed, lower dielectric layer 29 is patterned. Preferably, a spacer (not shown) to cover sidewalls of patterned intermediate plate 32 a is formed prior to patterning lower dielectric layer 29. As a result, properties of a capacitor are prevented from deteriorating due to etching damage caused by the formation of lower dielectric layer 29. A method of forming the spacer and a method of patterning lower dielectric layer 29 will be described in reference with FIG. 11 and FIG. 12.

However, returning to FIG. 4, an inter-insulating layer 41 is formed on patterned intermediate plate 32 a. Inter-insulating layer 41 is preferably formed from a low-k dielectric material, however, inter-insulating layer 41 may be formed from a material such as silicon dioxide (SiO₂) or silicon nitride (SiN). Inter-insulating layer 41 is planarized until a portion of inter-insulating layer 41 above patterned intermediate plate 32 a is removed.

Preferably, a first upper dielectric layer 37 is conformably provided prior to the formation of inter-insulating layer 41. First upper dielectric layer 37 covers patterned intermediate plate 32 a, and an upper portion of lower dielectric layer 29. First upper dielectric layer 37 prevents metal atoms from diffusing in patterned lower plate 26 a and lower interconnection line 26 b into inter-insulating layer 41. When lower dielectric layer 29 is patterned, first upper dielectric layer 37 covers patterned lower plate 26 a and lower interconnection line 26 b.

A polish stopping layer 39 is preferably formed to cover first upper dielectric layer 37. Polish stopping layer 39 protects an upper surface of first upper dielectric layer 37 when inter-insulating layer 41 is planarized. As a result, polish stopping layer 39 above patterned intermediate plate 32 a is exposed after inter-insulating layer 41 is planarized. Preferably, polish stopping layer 39 is an aluminum oxide layer.

Referring to FIG. 1 and FIG. 5, the exposed polish stopping layer 39 is removed by a wet etching process to expose first upper dielectric layer 37. The exposed first upper dielectric layer 37 may undergo a thermal treatment. The thermal treatment is preferably carried out in an atmosphere containing oxygen atoms or nitrogen atoms, such as O₂, O₂-plasma, O₃, N₂O, or NH₃. If polish stopping layer 39 is not formed, the thermal treatment restores any damage done to first upper dielectric layer 37.

A second upper dielectric layer 43 is then formed on planarized inter-insulating layer 41. Second dielectric layer 43 is formed of an oxidation material such as Al₂O₃, HfO₂, Ta₂O₅, La₂O₃, SrTiO₃ (ST), Ba_(x)Sr_(1-x)TiO₃, PbZr_(x)Ti_(1-x)O₃ (PZT), SrBi₂Ta₂O₅, or Zr₂O₃, silicon nitride (SiN), or oxynitride, and may be formed of at least two stacked layers.

Referring to FIG. 1 and FIG. 6, an upper insulating layer 47 is formed on second dielectric layer 43. Upper insulating layer 47 is preferably formed of low-k dielectric material, and the material may be silicon dioxide (SiO₂) or silicon nitride (SiN). Preferably, an etch-stop layer 45 is formed prior to the formation of upper insulating layer 47. Etch-stop layer 45 is formed of Al₂O₃.

Referring to FIG. 1 and FIG. 7, upper insulating layer 47 is patterned to form trenches 47 a, 47 b, and 47 c, which define a patterned upper plate 51 a, an upper interconnection line 51 b, and a second upper interconnection line 51 c, respectively. A first via hole 49 a, a second via hole 49 b, and a third via hole 49 c may be formed after or prior to the formation of trenches 47 a, 47 b, and 47 c.

Upper insulating layer 47 is patterned using a photolithography process and an etching process. Etch-stop layer 45 prevents second upper dielectric layer 45 from being damaged while upper insulating layer 47 is patterned. Etch-stop layer 45 below trenches 47 a, 47 b, and 47 c is removed by a wet etching process.

Referring to FIG. 1 and FIG. 8, an upper conductive layer is formed in trenches 47 a, 47 b, and 47 c. In addition, upper conductive layer also fills via holes 49 a, 49 b, and 49 c.

Upper conductive layer is planarized until the upper surface of upper insulating layer 47 is exposed. As a result, a first via 53 a, a second via 53 b, and a third via 53 c are formed within via holes 49 a, 49 b, and 49 c, respectively, and patterned upper plate 51 a, first upper interconnection line 51 b, and second upper interconnection line 51 c are formed and defined within trenches 47 a, 47 b, and 47 c, respectively. In addition, patterned upper plate 51 a includes an upper plate 51 a″. Patterned upper plate 51 a may include a third connecting portion 51 a′ electrically connected to the upper plate 51 a″. Third via 53 c directly and electrically connects lower interconnection line 26 b to second upper interconnection line 51 c. First via 53 a is formed at the same level as third via 53 c. Alternatively, as shown in FIG. 1, a third upper interconnection line 51 d crossing above first via 53 a may be formed at the same level as patterned upper plate 51 a. Third upper interconnection line 51 d may be a power line to supply voltage to patterned lower and upper plates 26 a and 51 a.

In accordance with the embodiments of the present invention, patterned upper plate 51 a and first upper interconnection line 51 b are formed using a damascene process. As a result, a photo process to pattern the upper plate is omitted, which leads to the fabrication of a semiconductor device having a dual stacked MIM capacitor with a reduced number of photomask processes.

FIGS. 9 to 15 are cross-sectional views to illustrate a method of fabricating a semiconductor device having a dual stacked MIM capacitor in accordance with another embodiment of the present invention.

Referring to FIG. 9, a lower insulating layer 63, and a patterned lower plate 65 a and a lower interconnection line 65 b are formed on a semiconductor substrate 61.

Referring to FIG. 10, a barrier metal layer 67, a lower dielectric layer 69, and an intermediate plate conductive layer 72 are sequentially formed on patterned lower plate 65 a and lower interconnection line 65 b. Barrier metal layer 67 is preferably a metal nitride layer of TiN, TaN or WN, a ternary compound layer containing Si or Al such as TaSiN or TaAlN, a noble metal layer such as Ir, Pt or Ru, or other layers such as Ti or Ta.

Lower dielectric layer 69 and intermediate plate conductive layer 72 may be formed of the same material as described with reference to FIG. 3.

A hard mask layer 77 is formed on intermediate plate conductive layer 72.

Referring to FIG. 11, hard mask layer 77 is patterned to form a patterned hard mask 77 a to define a patterned intermediate plate 72 a. Intermediate plate conductive layer 72 is then etched using patterned hard mask 77 a as an etch mask to form patterned intermediate plate 72 a. Patterned intermediate plate 72 a, as described with reference to FIG. 4, is a stacked structure of patterned first, second, and third intermediate plates 71 a, 73 a, and 75 a. After patterned intermediate plate 72 a is formed, lower dielectric layer 69 and barrier metal layer 67 are patterned.

Preferably, a spacer insulating layer 79 is formed on patterned intermediate plate 72 a. Patterned hard mask 77 a may be removed prior to the formation of spacer insulating layer 79. However, it is preferable not to remove patterned hard mask 77 a prior to the formation of spacer insulating layer 79.

Referring to FIG. 12, spacer insulating layer 79 is etched to form a spacer 79 a to cover sidewalls of patterned intermediate plate 72 a. Portions of lower dielectric layer 69 and barrier metal layer 67 are etched using spacer 79 a and patterned hard mask 77 a as an etch mask. As a result, a patterned lower dielectric layer 69 a and a patterned barrier metal layer 67 a are formed. Patterned hard mask 77 a prevents patterned intermediate plate 72 a from being etched while lower dielectric layer 69 and barrier metal layer 67 are etched. Patterned hard mask 77 a is removed after patterned barrier metal layer 67 a is formed.

If patterned hard mask 77 a is not used as the etch mask, patterned intermediate plate 72 a may be used as the etch mask to etch lower dielectric layer 69 and barrier metal layer 67.

Referring to FIG. 13, an inter-insulating layer 85 is formed on patterned intermediate plate 72 a. Inter-insulating layer 85 is preferably formed of low-k dielectric material, however, it may be formed from a material such as silicon dioxide (SiO₂) or a silicon nitride (SiN). Inter-insulating layer 85 is then planarized until inter-insulating layer 85 above patterned intermediate plate 72 a is removed.

Preferably, a first upper dielectric layer 81 is conformably formed prior to the formation of inter-insulating layer 85. First upper dielectric layer 81 covers an upper portion of patterned intermediate plate 72 a and spacer 79 a. In addition, first upper dielectric layer 81 covers sidewalls of patterned barrier metal layer 67 a and patterned lower dielectric layer 69 a, and patterned lower plate 65 a and lower interconnection line 65 b. First upper dielectric layer 81 prevents metal atoms from diffusing in patterned lower plate 65 a and lower interconnection line 65 b into inter-insulating layer 85.

As described with reference to FIG. 4, a polish stopping layer 83 may be formed to cover first upper dielectric layer 81. Polish stopping layer 83 protects an upper surface of first upper dielectric layer 81 while inter-insulating layer 85 is planarized. As a result, polish stopping layer 83 above patterned intermediate plate 72 a, is exposed after inter-insulating layer 85 is planarized.

Referring to FIG. 14, as described with reference to FIG. 5, exposed polish stopping layer 83 is removed by a wet etching process. In addition, thermal treatment may be performed on first upper dielectric layer 81. A second upper dielectric layer 87 is then formed on the planarized inter-insulating layer 85.

In addition, as described with reference to FIG. 6, an etch-stop layer 89 and an upper insulating layer 91 are formed on second upper dielectric layer 87.

Referring to FIG. 15, as described with reference to FIG. 7 and FIG. 8, a patterned upper plate 93 a, a first upper interconnection line 93 b, and a second upper interconnection line 93 c are formed within upper insulating layer 91. In addition, a first via 95 a to connect patterned upper plate 93 a to patterned lower plate 65 a, a second via 95 b to connect upper interconnection line 93 b to patterned intermediate plate 72 a, and a third via 95 c to connect second upper interconnection line 93 c to the lower interconnection line 65 b are formed.

In accordance with the second embodiment of the present invention, etch damage may occur on sidewalls of patterned lower dielectric layer 69 a while patterned lower dielectric layer 69 a and patterned barrier meal layer 67 a are formed. However, by means of spacer 79 a, the properties of the MIM capacitor are protected from damage due to the etching of patterned lower dielectric layer 69 a.

Exemplary embodiments of the present invention have been disclosed herein and, although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the scope of the present invention as set forth in the following claims. 

1. A semiconductor device, comprising: a semiconductor substrate; a dual stacked Metal-Insulator-Metal capacitor having a lower plate disposed on the semiconductor substrate, an upper plate electrically connected to the lower plate and disposed above the lower plate, and an intermediate plate interposed between the lower plate and the upper plate; and a first upper interconnection line positioned at the same level as the upper plate and electrically connected to the intermediate plate.
 2. The semiconductor device of claim 1, wherein the dual stacked MIM capacitor further comprises a lower dielectric layer interposed between the lower plate and the intermediate plate, and a first upper dielectric layer and a second upper dielectric layer.
 3. The semiconductor device of claim 2, further comprising: a lower interconnection line positioned at the same level as the lower plate; and a second upper interconnection line spaced apart from the upper interconnection line and positioned at the same level as the first upper interconnection line, the second upper interconnection line being electrically connected to the lower interconnection line.
 4. The semiconductor device of claim 3, wherein the lower plate and the lower interconnection line each comprise a barrier metal layer and a metal layer.
 5. The semiconductor device of claim 2, further comprising: a first via extending through the first and second upper dielectric layers and the lower dielectric layer to electrically connect the upper plate and the lower plate; a second via extending through the first and second upper dielectric layers to electrically connect the first upper interconnection line and the intermediate plate; and a third via extending through the first and second upper dielectric layers and the lower dielectric layer to directly connect the second upper interconnection line and the lower interconnection line, wherein the first via is positioned at the same level as the third via.
 6. The semiconductor device of claim 1, further comprising a spacer to cover sidewalls of the intermediate plate.
 7. The semiconductor device of claim 6, further comprising a lower dielectric layer and a barrier metal layer aligned and disposed below the intermediate plate and the spacer.
 8. The semiconductor device of claim 1, further comprising: an upper insulating layer to insulate the upper plate, first interconnection line, and second interconnection line; an etch stop layer disposed between the upper insulating layer and intermediate plate; and an inter-insulating layer disposed between the etch stop layer and the intermediate plate.
 9. A method of fabricating a semiconductor device, comprising: forming a lower insulating layer on a semiconductor substrate, forming a patterned lower plate and a lower interconnection line on the lower insulating layer; forming an patterned intermediate plate comprising a first intermediate plate conductive layer, a second intermediate plate conductive layer, and a third intermediate plate conductive layer; sequentially forming an etch stop layer and an upper insulating layer on the patterned intermediate plate; patterning the upper insulating layer to form a plurality of trenches; forming a first via hole to expose the patterned lower plate, a second via hole to expose the patterned intermediate plate, and a third via hole to expose the lower interconnection line; and filling the plurality of trenches and via holes with a conductive material, thereby forming a patterned upper plate electrically connected to the patterned lower plate, a patterned first upper interconnection line electrically connected to the patterned intermediate plate, and a patterned second interconnection line electrically connected to the lower connection line.
 10. The method of claim 9, further comprising: forming a barrier metal layer between the lower insulating layer and the patterned intermediate plate; forming a lower dielectric layer on the barrier metal layer, and on sidewalls and on the patterned intermediate plate; forming a first upper dielectric layer on the lower dielectric layer; forming an inter-insulating layer on the first upper dielectric layer; and forming a second upper dielectric layer between the first upper dielectric and the etch stop layer.
 11. The method of claim 10, further comprising: forming a polish stopping layer to cover the first upper dielectric layer before forming the inter-insulating layer; and removing the polish stopping layer above the patterned intermediate plate after planarizing the inter-insulating layer.
 12. The method of claim 9, wherein each of the patterned lower plate and the lower connection line comprises a lower metal layer and a barrier metal layer.
 13. The method of claim 12, wherein the lower metal layer is formed from a metal selected from a group consisting of W, Al and Cu; and, wherein the barrier metal layer is formed from a metal selected from a group consisting of TiN, TaN, WN, Si, Al, TaSiN, TaAlN, Ir, Pt, Ru, Ti, and Ta.
 14. The method of claim 9, wherein the first and third intermediate plate conductive layers are formed from a metal selected from a group consisting of Ta, Ti, TaN, TiN, WN and Ru; and, wherein the second intermediate plate conductive layer is formed from a metal selected from a group consisting of Al and W.
 15. A method of fabricating a semiconductor device, comprising: forming a lower insulating layer a semiconductor substrate, forming a patterned lower plate and a lower interconnection line on the lower insulating layer; forming an patterned intermediate plate comprising a first intermediate plate conductive layer, a second intermediate plate conductive layer, and a third intermediate plate conductive layer; forming a spacer on sidewalls of the patterned intermediate plate; sequentially forming an etch stop layer and an upper insulating layer on the patterned intermediate plate; patterning the upper insulating layer to form a plurality of trenches; forming a first via hole to expose the patterned lower plate, a second via hole to expose the patterned intermediate plate, and a third via hole to expose the lower interconnection line; and filling the plurality of trenches and via holes with a conductive material, thereby forming a patterned upper plate electrically connected to the patterned lower plate, a patterned first upper interconnection line electrically connected to the patterned intermediate plate, and a patterned second interconnection line electrically connected to the lower connection line.
 16. The method of claim 15, further comprising; forming a barrier metal layer on the patterned lower plate and lower interconnection line; forming a lower dielectric layer between the barrier metal layer and the patterned intermediate plate; forming a spacer insulating layer on the lower dielectric layer and the patterned intermediate plate; etching the spacer insulating layer to form the spacer on the sidewalls of the patterned intermediate plate; etching the lower dielectric layer and the barrier metal layer by using the spacer as an etch mask to form a patterned lower dielectric layer and patterned barrier metal layer, respectively; forming a first upper dielectric layer on the spacers, the patterned lower dielectric layer, the patterned barrier metal layer; forming an inter-insulating layer on the first upper dielectric layer; and forming a second upper dielectric layer between the first upper dielectric and the etch stop layer.
 17. The method of claim 15, further comprising: forming a polish stopping layer to cover the first upper dielectric layer before forming the inter-insulating layer; and removing the polish stopping layer above the patterned intermediate plate after planarizing the inter-insulating layer.
 18. The method of claim 15, wherein the first and third intermediate plate conductive layers are formed from a metal selected from a group consisting of Ta, Ti, TaN, TiN, WN and Ru; and, wherein the second intermediate plate conductive layer is a formed from a metal selected from a group consisting of Al and W. 